Bonded Marketplace Bond Protocol Raises $2.5 Million In Seed Round

Bond Protocol has closed a $2.5 million seed round led by Chapter One Ventures and IDEO CoLab Ventures, with participation from Alchemy Ventures, Hypersphere, and others.

The founding team says they will use the fresh funding to accelerate its product roadmap to become the first platform for bonds-as-a-service.

Previously, the vote on OlympusDAO’s proposal to split the bonded marketplace Olympus Pro and rename it Bond Protocol was approved, and OlympusDAO would process its bonds through the platform.

This project would reportedly feature Permissionless Markets, Composable Bonds (tokenized), Modular Auction interfaces, and more. On October 4, its beta dApp was live.

Jack Lipstone, the Investment Partner at Chapter One, an early-stage web3 fund, said:

“Bond Protocol’s asset accrual mechanism is a key first step in delivering value to a massive total addressable market in crypto. Chapter One looks to support companies that make web3 as easy to use as web2, and Bond Protocol is at the forefront of DAO-to-DAO innovation. We are excited to be a part of their journey as lead investors.”

Bond Protocol is the next evolution of bonds-as-a-service. Olympus-style bonds have revolutionized the way protocols approach acquiring assets.

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