BTC

$95340.246

-1.62%

ETH

$3292.885

-1.23%

XRP

$2.219

-0.94%

BNB

$649.526

-1.64%

DeFi

Bonded Marketplace Bond Protocol Raises $2.5 Million In Seed Round

October 9, 2022 - Around 2 mins mins to read
Bond Protocol has closed a $2.5 million seed round led by Chapter One Ventures and IDEO CoLab Ventures, with participation from Alchemy Ventures, Hypersphere, and others.
Bonded Marketplace Bond Protocol Raises $2.5 Million In Seed Round

The founding team says they will use the fresh funding to accelerate its product roadmap to become the first platform for bonds-as-a-service.

Previously, the vote on OlympusDAO’s proposal to split the bonded marketplace Olympus Pro and rename it Bond Protocol was approved, and OlympusDAO would process its bonds through the platform.

This project would reportedly feature Permissionless Markets, Composable Bonds (tokenized), Modular Auction interfaces, and more. On October 4, its beta dApp was live.

Jack Lipstone, the Investment Partner at Chapter One, an early-stage web3 fund, said:

“Bond Protocol’s asset accrual mechanism is a key first step in delivering value to a massive total addressable market in crypto. Chapter One looks to support companies that make web3 as easy to use as web2, and Bond Protocol is at the forefront of DAO-to-DAO innovation. We are excited to be a part of their journey as lead investors.”

Bond Protocol is the next evolution of bonds-as-a-service. Olympus-style bonds have revolutionized the way protocols approach acquiring assets.

DISCLAIMER: The Information on this website is provided as general market commentary and does not constitute investment advice. We encourage you to do your own research before investing.

Join us to keep track of news: https://linktr.ee/coincu

Website: coincu.com

Harold

CoinCu News

Alchemy Ventures

Bond Protocol

Chapter One Ventures

IDEO CoLab Ventures

Olympus Pro

OlympusDAO

Author

Harold

With a passion for untangling the complexities of the financial world, I've spent over four years in financial journalism, covering everything from traditional equities to the cutting edge of venture capital. "The financial markets are a fascinating puzzle," I often say, "and I love helping people make sense of them." That's what drives me to bring clear and insightful financial journalism to the readers of Coincu.
DeFi

Bonded Marketplace Bond Protocol Raises $2.5 Million In Seed Round

Bond Protocol has closed a $2.5 million seed round led by Chapter One Ventures and IDEO CoLab Ventures, with participation from Alchemy Ventures, Hypersphere, and others.
Bonded Marketplace Bond Protocol Raises $2.5 Million In Seed Round

The founding team says they will use the fresh funding to accelerate its product roadmap to become the first platform for bonds-as-a-service.

Previously, the vote on OlympusDAO’s proposal to split the bonded marketplace Olympus Pro and rename it Bond Protocol was approved, and OlympusDAO would process its bonds through the platform.

This project would reportedly feature Permissionless Markets, Composable Bonds (tokenized), Modular Auction interfaces, and more. On October 4, its beta dApp was live.

Jack Lipstone, the Investment Partner at Chapter One, an early-stage web3 fund, said:

“Bond Protocol’s asset accrual mechanism is a key first step in delivering value to a massive total addressable market in crypto. Chapter One looks to support companies that make web3 as easy to use as web2, and Bond Protocol is at the forefront of DAO-to-DAO innovation. We are excited to be a part of their journey as lead investors.”

Bond Protocol is the next evolution of bonds-as-a-service. Olympus-style bonds have revolutionized the way protocols approach acquiring assets.

DISCLAIMER: The Information on this website is provided as general market commentary and does not constitute investment advice. We encourage you to do your own research before investing.

Join us to keep track of news: https://linktr.ee/coincu

Website: coincu.com

Harold

CoinCu News